Flexad

DESCRIPTION

This project aimed to develop new conductive adhesives which fill all functional requirements of present day solder and were intended to be a substitute for lead-free solder. This new adhesive was based on an epoxy-compound containing different nano-materials (carbon nano-fibers and other nano-particles). The challenge was to obtain high electrical conductive adhesive while maintaining high-elongation before rupture and flexibility to have good mechanical behaviour in thermo-mechanical fatigue.

The specific objectives of the project included the development of the adhesive, studying and selecting its components; the development of the manufacturing process; semi-industrial implementation and fine-tuning of the manufacturing process, and finally, the techno-economic assessment  of the product and the final process.

The project was a success after the development of a competitive conductive adhesive both for its technical performance as for its price and with the filling of a new patent to protect and commercialize the product.

Funding info

FLEXAD is an EURIPIDES R&D PROJECT (nº07-303)

Consortium members

• INASMET-TECNALIA
• GAIRESA
• NANOGAP
• THALES EPM
• THALES ALENIA SPACE
• IKOR
• CONTINENTAL AUTOMOTIVE