This project aimed to develop new conductive adhesives which fill all functional requirements of present day solder and were intended to be a substitute for lead-free solder. This new adhesive was based on an epoxy-compound containing different nano-materials (carbon nano-fibers and other nano-particles). The challenge was to obtain high electrical conductive adhesive while maintaining high-elongation before rupture and flexibility to have good mechanical behaviour in thermo-mechanical fatigue.
The specific objectives of the project included the development of the adhesive, studying and selecting its components; the development of the manufacturing process; semi-industrial implementation and fine-tuning of the manufacturing process, and finally, the techno-economic assessment of the product and the final process.
The project was a success after the development of a competitive conductive adhesive both for its technical performance as for its price and with the filling of a new patent to protect and commercialize the product.
FLEXAD is an EURIPIDES R&D PROJECT (nº07-303)
- THALES EPM
- THALES ALENIA SPACE
- CONTINENTAL AUTOMOTIVE