| Project Title | Necomada |
| Website | http://necomada.eu/ |
| Year Start | 2017 |
| Year End | 2019 |
| Consortium members | Centre for Process
Innovation Limited, United Kingdom Henkel Electronic Materials (Belgium) NV, Belgium PRAGMATIC PRINTING LIMITED, United Kingdom TEKNOLOGISK INSTITUT, Denmark ContiTech Elastomer-Beschichtungen GmbH, Germany NANOGAP SUB-NM-POWDER SA, Spain THOMAS SWAN & CO LIMITED, United Kingdom BSH ELECTRODOMESTICOS ESPANA SA, Spain HENKEL KGaA, Germany Crown Packagin UK PLC, United Kingdom FRAUNHOFER GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V., Germany TYOETERVEYSLAITOS, Finland NXP SEMICONDUCTORS BELGIUM NV, Belgium |
| Description | The project targets the incorporation of advanced functional materials to
deliver customised conductive inks and flexible adhesives compatible with
high volume manufacturing platforms. Specifically the development of these
enabling materials will support high speed roll to roll integration of hybrid
and large area electronics to address internet of things opportunities The consortium will integrate materials development with end application requirements in terms of technical performance (thermal/electrical conductivity, processing conditions, materials integrity and adhesion) and unit cost of production to facilitate market adoption. The project will utilise and build on existing CPI pilot facilities (R2R print line) to demonstrate technology integration, manufacturability and produce components for end user evaluation to enable the direct comparison of production techniques. The project delivers a supply chain to support future commercialisation: incorporating materials suppliers of inks and adhesives, supporting RTO in Formulation and nano-particle production, established high fidelity print equipment manufacturers, electronic device manufacturers, established pilot line facilities and potential end users from the apparel, packaging and healthcare sector – relating to the Internet of Things. |
| Core Technology | Conductive Nanomaterials |
| Industry of application | Conductive materials |
| Call | H2020 |
| Funding info | This project has received funding from the European Union’s Horizon 2020 research and innovation programme under grant agreement No 720897 |
