| Project Title | Flexad |
| Year Start | 2009 |
| Year End | 2012 |
| Consortium members | INASMET-TECNALIA GAIRESA NANOGAP THALES EPM THALES ALENIA SPACE IKOR CONTINENTAL AUTOMOTIVE |
| Description | Flexible conductive adhesive for substitution of lead-free solders on
PCBs FlexAd project aims to develop new flexible electrically conductive adhesive (ECA) intended to be a substitute for lead-free solder. This new adhesive will be based on an epoxy-compound containing different nano-materials (carbon nano-fibers and other nano-particles). The challenge is to obtain high electrical conductive adhesive while maintaining high-elongation before rupture and flexibility to have good mechanical behaviour in thermo-mechanical fatigue. |
| Core Technology | Conductive Nanomaterials |
| Industry of application | Conductive materials |
| Call | Euripides |
| Funding info | FLEXAD is an EURIPIDES R&D PROJECT (nº07-303) |
