Flexad

Project Title Flexad
Year Start 2009
Year End 2012
Consortium members INASMET-TECNALIA
GAIRESA
NANOGAP
THALES EPM
THALES ALENIA SPACE
IKOR
CONTINENTAL AUTOMOTIVE
Description Flexible conductive adhesive for substitution of lead-free solders on PCBs
FlexAd project aims to develop new flexible electrically conductive adhesive (ECA) intended to be a substitute for lead-free solder. This new adhesive will be based on an epoxy-compound containing different nano-materials (carbon nano-fibers and other nano-particles). The challenge is to obtain high electrical conductive adhesive while maintaining high-elongation before rupture and flexibility to have good mechanical behaviour in thermo-mechanical fatigue.
Core Technology Conductive Nanomaterials
Industry of application Conductive materials
Call Euripides
Funding info FLEXAD is an EURIPIDES R&D PROJECT (nº07-303)