THALES ALENIA SPACE
|Description||Flexible conductive adhesive for substitution of lead-free solders on
FlexAd project aims to develop new flexible electrically conductive adhesive (ECA) intended to be a substitute for lead-free solder. This new adhesive will be based on an epoxy-compound containing different nano-materials (carbon nano-fibers and other nano-particles). The challenge is to obtain high electrical conductive adhesive while maintaining high-elongation before rupture and flexibility to have good mechanical behaviour in thermo-mechanical fatigue.
|Core Technology||Conductive Nanomaterials|
|Industry of application||Conductive materials|
|Funding info||FLEXAD is an EURIPIDES R&D PROJECT (nº07-303)|